System and Method for a High Retention Module Interface

ABSTRACT

A device includes a substrate, a first antenna connection, and a first retention mechanism. The substrate has atop surface and a bottom surface. The first antenna connection is mounted directly to the top surface of the substrate, and is configured to connect with a first antenna. The first retention mechanism is connected at a first location of the bottom surface of the substrate to provide support for the substrate at the first antenna connection when the first antenna connection is connected to the first antenna. The first location of the first retention mechanism is selected to be directly below the first antenna connection.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/219,237, entitled “System and Method for a High Retention ModuleInterface,” filed on Aug. 26, 2011, the disclosure of which is herebyexpressly incorporated by reference in its entirety.

FIELD OF THE DISCLOSURE

This disclosure generally relates to information handling systems, andmore particularly relates to a system and method for a high retentionmodule interface.

BACKGROUND

As the value and use of information continues to increase, individualsand businesses seek additional ways to process and store information.One option is an information handling system. An information handlingsystem generally processes, compiles, stores, and/or communicatesinformation or data for business, personal, or other purposes. Becausetechnology and information handling needs and requirements can varybetween different applications, information handling systems can alsovary regarding what information is handled, how the information ishandled, how much information is processed, stored, or communicated, andhow quickly and efficiently the information can be processed, stored, orcommunicated. The variations in information handling systems allow forinformation handling systems to be general or configured for a specificuser or specific use such as financial transaction processing, airlinereservations, enterprise data storage, or global communications. Inaddition, information handling systems can include a variety of hardwareand software components that can be configured to process, store, andcommunicate information and can include one or more computer systems,data storage systems, and networking systems.

An information handling system, such as a wireless device, can include aradio module to enable the wireless device to transmit and receive data.The radio module can be a minicard or a modular solder down radio, whichcan be attached to a mother board of the wireless device. The radiomodule can be soldered to the mother board to provide high retention ofthe radio module to the mother board. The radio module may also have anantenna that can be connected to the radio module during a manufacturingprocess of the module.

BRIEF DESCRIPTION OF THE DRAWINGS

It will be appreciated that for simplicity and clarity of illustration,elements illustrated in the Figures have not necessarily been drawn toscale. For example, the dimensions of some of the elements areexaggerated relative to other elements. Embodiments incorporatingteachings of the present disclosure are shown and described with respectto the drawings presented herein, in which:

FIG. 1 is a diagram illustrating a communication system including amodule connected to a mother board;

FIG. 2 is a diagram illustrating a top surface of a substrate of themodule;

FIG. 3 is a diagram illustrating a bottom surface of the substrate ofthe module;

FIG. 4 is a diagram illustrating another embodiment of the bottomsurface of the substrate of the module; and

FIG. 5 is a flow diagram of a method for manufacturing a module solderdown radio.

The use of the same reference symbols in different drawings indicatessimilar or identical items.

DETAILED DESCRIPTION OF DRAWINGS

The following description in combination with the Figures is provided toassist in understanding the teachings disclosed herein. The followingdiscussion will focus on specific implementations and embodiments of theteachings. This focus is provided to assist in describing the teachingsand should not be interpreted as a limitation on the scope orapplicability of the teachings. However, other teachings can certainlybe utilized in this application.

FIG. 1 shows a communication system 100 for an information handlingsystem. For purposes of this disclosure, the information handling systemmay include any instrumentality or aggregate of instrumentalitiesoperable to compute, classify, process, transmit, receive, retrieve,originate, switch, store, display, manifest, detect, record, reproduce,handle, or utilize any form of information, intelligence, or data forbusiness, scientific, control, entertainment, or other purposes. Forexample, an information handling system may be a personal computer, aPDA, a consumer electronic device, a network server or storage device, aswitch router or other network communication device, or any othersuitable device and may vary in size, shape, performance, functionality,and price. The information handling system may include memory, one ormore processing resources such as a central processing unit (CPU) orhardware or software control logic. Additional components of theinformation handling system may include one or more storage devices, oneor more communications ports for communicating with external devices aswell as various input and output (I/O) devices, such as a keyboard, amouse, and a video display. The information handling system may alsoinclude one or more buses operable to transmit communications betweenthe various hardware components.

The communication system 100 includes a printed circuit board 102, suchas a mother board, and a module 104. The printed circuit board 102 isconnected to the module 104 via a number of solder tabs 106. The module104 includes a substrate 108, an antenna connection 110, and a number ofcomponents 112. The antenna connection 110 can be connected to anantenna 114. The module 104 can be a modular radio for a wirelessdevice, such as a laptop computer, a cellular telephone, a tabletcomputer, a personal digital assistant, or the like.

The solder tabs 106 can be attached to the substrate 108 of the module104 during manufacturing of the module or can be attached directly tothe printed circuit board 102. When the manufacturing of the module 104is completed, the module can be connected to the printed circuit board102 by heating the solder tabs 106 so that the solder tabs can fuse withand can establish an attachment to the printed circuit board. The soldertabs 106 can provide support to the substrate 108, which can have athickness that is significantly less than a thickness of the printedcircuit board 102. For example, the substrate 1108 can have a thicknessof a half millimeter, the printed circuit board 102 can have a thicknessof three millimeters, and the solder tabs 106 can have an thickness ofthree tenths of a millimeter. The solder tabs 106 can connect thesubstrate 1108 of the module 104 to the printed circuit board 102 inmultiple locations, such that the substrate can be supported by theprinted circuit board via the solder tabs. Thus, stress exerted on thesubstrate 108 through the substrate flexing during normal operation ofthe communication system 100 can pass from the substrate to the printedcircuit board 102 via the solder tabs 106. The solder tabs 106 can bedistributed on the substrate 108, such that the entire substrate can besupported by thicker printed circuit board 102 via the solder tabs.

The antenna connection 110 is in communication with the components 112,such that the components can utilize the antenna connection and theantenna. 114 to transmit and receive data. The module 104 can beprovided as a primary radio for communication system 100 via the antennaconnection 110 and the antenna 114. During the manufacturing process ofthe module 104, the antenna 114 can be manually connected to the antennaconnection 110. For example, an individual can press the antenna 114down onto the antenna connection 110 with a downward force until theantenna snap fits on the antenna connection. The downward force exertedon the antenna connection 110 can cause additional stress on thesubstrate 108 that the solder tabs 106 are not designed to support, suchthat the substrate may shear or facture through communication tinesrunning on the substrate from the antenna connection to the components112.

FIG. 2 shows the module 104 including a top surface 202 of the substrate108, multiple antenna connections 110, and multiple components 112. Eachof the antenna connections 110 can be located at a different location onthe top surface 202 of the substrate 104. In an embodiment, the antennaconnections 110 can be located along a single edge of the top surface202, such that the stress applied to the substrate can be at a locationthat is away from the more rigid portion of the substrate where thecomponents are located. In another embodiment, a shield cover or Faradaycover can be connected to the top surface 202 of the substrate 108 tocover and protect the components 112 but not the antenna connections110. The shield cover can strengthen the part of the substrate 108 thatis covered by the shield cover, but can cause the portion of thesubstrate where the antenna connections 110 are located to be affectedmore by the force and stress exerted on the substrate when the antennas114 are connected to the antenna connections.

FIG. 3 shows the module 104 including a bottom surface 302 of thesubstrate 108, a retention mechanism 304, and the solder tabs 106. Theretention mechanism 304 and the solder tabs 106 can be connected to thebottom surface 302 of the substrate 108. In an embodiment, the soldertabs 106 can be connected around an edge of the bottom surface 302 tosecure the substrate 108 to the printed circuit board 102.

A location of the retention mechanism 304 can be selected so that theretention mechanism is directly below the antenna connections 110. In anembodiment, the retention mechanism 304 can be rectangular and extendalong the bottom surface 302 of the substrate 108 for substantially thesame distance as a distance from one of the antenna connections 110 onthe top surface 202 of the substrate, The retention mechanism 304 can bea small array pattern of solder tabs, an epoxy, glue, or the like. In anembodiment, a height of the retention mechanism 304 can controlledand/or set by layering epoxy or glue to a desired height,

The retention mechanism 304 can be connected to the printed circuitboard 102 in substantially the same manner as discussed above withrespect to the solder tabs 106. When the module 104 is connected to theprinted circuit board 102 via the solder tabs 106 and the retentionmechanism 304, the retention mechanism can provide support for thesubstrate 108 at the locations of the antenna connections 110. Thus,when the antenna connections 110 are connected to the antennas 114, anyforce or stress exerted on the substrate 108 can be passed to theprinted circuit board 102 via the retention mechanism 304. In anembodiment, the stress exerted on the substrate 108 when the antenna 114is connected to the antenna contention 110 is greater than the normalstress on the substrate caused by the substrate flexing.

FIG. 4 shows the module 104 including the bottom surface 302 of thesubstrate 108, retention mechanisms 404, 406, and 408, and the soldertabs 106. The retention mechanisms 404, 406, and 408, and the soldertabs 106 can be connected to the bottom surface 302 of the substrate108. The retention mechanisms 404, 406, and 408 can be a small arraypattern of solder tabs, an epoxy, glue, or the like. In an embodiment,the solder tabs 106 can be connected all over the bottom surface 302 tosecure the substrate 108 to the printed circuit board 102. The soldertabs 106 can be randomly or evenly distributed on the bottom surface302.

Location of the retention mechanisms 404, 406, and 408 can be selectedso that each one of the retention mechanisms is directly below adifferent one of the antenna connections 110. The retention mechanism404 can be shaped such as to form an outline of one of the antennaconnections 110. The retention mechanism 406 can be a star burst designand can be located on the bottom surface 302 of the substrate 108directly below one of the antenna connections 110. The retentionmechanism 408 can be a crescent shape and can be located on the bottomsurface 302 of the substrate 108 directly below one of the antennaconnections 110. The retention mechanisms 404, 406, and 408 can beconnected to the printed circuit board 102 in substantially the samemanner as discussed above with respect to the solder tabs 106. When themodule 104 is connected to the printed circuit board 102 via the soldertabs 106 and the retention mechanisms 404, 406, and 408, the retentionmechanisms can provide support for the substrate 108 at the locations ofthe antenna connections 110. Thus, when the antenna connections 110 areconnected to the antennas 114, any force or stress exerted on thesubstrate 108 can be passed to the printed circuit board 102 via theretention mechanisms 404, 406, and 408.

FIG. 5 shows a method 500 for manufacturing a module solder down radio.At block 502, a first antenna connection is attached to a top surface ofa substrate at a first location of the top surface. A plurality ofsolder tabs are attached to a bottom surface of the substrate at block504. an embodiment, the plurality of solder tabs can connect thesubstrate to a printed circuit board and can provide support to all ofthe substrate, The plurality of solder tabs can be distributed on thebottom surface of the substrate.

At block 506, a second location of a bottom surface of the substrate isdetermined for a first retention mechanism based on the first locationof the first antenna connection, The second location can be directlybelow the first antenna connection. The first retention mechanism isattached to the bottom surface of the substrate at the second locationof the bottom surface at block 508. The first retention mechanism canprovide support for the substrate when the first antenna connection isconnected to a first antenna.

At block 510, a second antenna connection is attached to the top surfaceof a substrate at a third location of the top surface, In an embodiment,the second location of the first retention mechanism on the bottomsurface is directly below the third location of the second antennaconnection. At block 512, a determination is made whether the secondlocation of the first retention mechanism on the bottom surface isdirectly below the third location of the second antenna connection. Ifthe second location of the first retention mechanism on the bottomsurface is directly below the third location of the second antennaconnection, the module is completed at block 514. However, if the secondlocation of the first retention mechanism on the bottom surface is notdirectly below the third location of the second antenna connection, afourth location on the bottom surface of the substrate is determined fora second retention mechanism based on the third location of the secondantenna connection at block 516. The fourth location can be directlybelow the second antenna connection.

At block 518, the second retention mechanism is attached to the bottomsurface of the substrate at the fourth location on the bottom surface,and then the module is completed at block 514. The second retentionmechanism can provide support for the substrate when the second antennaconnection is connected to a second antenna. The substrate can be aportion of the module configured to provide a primary radio for awireless device via the first antenna connection and the first antenna.

Although only a few exemplary embodiments have been described in detailabove, those skilled in the art will readily appreciate that manymodifications are possible in the exemplary embodiments withoutmaterially departing from the novel teachings and advantages of theembodiments of the present disclosure. For example, the methodsdescribed in the present disclosure can be stored as instructions in acomputer readable medium to cause a processor to perform the method.Additionally, the methods described in the present disclosure can bestored as instructions in a non-transitory computer readable medium,such as a hard disk drive, a solid state drive, a flash memory, and thelike. Accordingly, all such modifications are intended to be includedwithin the scope of the embodiments of the present disclosure as definedin the following claims. In the claims, means-plus-function clauses areintended to cover the structures described herein as performing therecited function and not only structural equivalents, but alsoequivalent structures.

What is claimed is:
 1. A device comprising: a substrate having a topsurface and a bottom surface; a plurality of solder tabs connected tothe bottom surface of the substrate, wherein the solder tabs areconfigured to provide support to the substrate; a first antennaconnection mounted directly to the top surface of the substrate, whereinthe first antenna connection is configured to connect with a firstantenna; and a first retention mechanism connected at a first locationof the bottom surface of the substrate to provide support for thesubstrate at the first antenna connection when the first antennaconnection is connected to the first antenna, wherein the first locationof the first retention mechanism is directly below the first antennaconnection.
 2. The device of claim 1 further comprising: a secondantenna connection mounted directly to the top surface of the substrate,wherein the second antenna connection is configured to connect with asecond antenna; and a second retention mechanism connected to a secondlocation of the bottom surface of the substrate to provide support forthe substrate when the second antenna connection is connected to thesecond antenna, wherein the second location of the second retentionmechanism is selected to be directly below the second antennaconnection.
 3. The device of claim 1 further comprising: a secondantenna connection mounted directly to the top surface of the substrate,wherein the second antenna connection is configured to connect with asecond antenna wherein the first location of the first retentionmechanism is selected to be directly below the second antennaconnection.
 4. The device of claim 3 wherein the first retention isrectangular and extends along the bottom surface of the substrate for asubstantially similar distance as a distance of the first antennaconnection to the second antenna connection on the top surface of thesubstrate.
 5. The device of claim 1 wherein the first retentionmechanism is shaped as an outline of the first antenna connection. 6.The device of claim 1 wherein the first retention mechanism isconfigured to provide a ground potential for the device.
 7. The deviceof claim 1 wherein the device is configured to provide a primary radiofor a wireless device via the first antenna connection and the firstantenna.
 8. A device comprising: a printed circuit board; a substratehaving a top surface and a bottom surface; a plurality of solder tabsconnected to the bottom surface of the substrate, wherein the soldertabs are configured to connect the substrate to the printed circuitboard and to provide support to the substrate, and wherein the soldertabs are evenly distributed on the bottom surface of the substrate; afirst antenna connection mounted directly to a first location of the topsurface of the substrate, wherein the first antenna connection isconfigured to connect with a first antenna; and a first retentionmechanism connected at a second location of the bottom surface of thesubstrate to provide support for the substrate at the first antennaconnection when the first antenna connection is connected to the firstantenna, wherein the first location of the first retention mechanism isdirectly below the first antenna connection.
 9. The device of claim 8further comprising: a second antenna connection mounted directly to thetop surface of the substrate, wherein the second antenna connection isconfigured to connect with a second antenna; and a second retentionmechanism connected to a second location of the bottom surface of thesubstrate to provide support for the substrate when the second antennaconnection is connected to the second antenna, wherein the secondlocation of the second retention mechanism is selected to be directlybelow the second antenna connection.
 10. The device of claim 8 furthercomprising: a second antenna connection mounted directly to the topsurface of the substrate, wherein the second antenna connection isconfigured to connect with a second antenna wherein the first locationof the first retention mechanism is selected to be directly below thesecond antenna connection.
 11. The device of claim 10 wherein the firstretention is rectangular and extends along the bottom surface of thesubstrate for a substantially similar distance as a distance of thefirst antenna connection to the second antenna connection on the topsurface of the substrate.
 12. The device of claim 8 wherein the firstretention mechanism is a crescent shape directly on the opposite side ofthe substrate as the first antenna connection.
 13. The device of claim 8wherein a stress exerted when the first antenna is connected to thefirst antenna contention is greater than a normal flex stress on thesubstrate.
 14. The device of claim 8 wherein the device is configured toprovide a primary radio for a wireless device via the first antennaconnection and the first antenna.
 15. A method comprising: attaching afirst antenna connection to a top surface of a substrate at a firstlocation of the top surface; attaching a plurality of solder tabs to abottom surface of the substrate, wherein the solder tabs are configuredto connect the substrate to a printed circuit board and to providesupport to of the substrate, and wherein the solder tabs are evenlydistributed on the bottom surface of the substrate; determining a secondlocation on a bottom surface of the substrate for a first retentionmechanism based on the first location of the first antenna connection,wherein the second location is directly below the first antennaconnection; and attaching the first retention mechanism to the bottomsurface of the substrate at the second location of the bottom surface,wherein the first retention mechanism is configured to provide supportfor the substrate at the first location when the first antennaconnection is connected to a first antenna.
 16. The method of claim 15father comprising: attaching a second antenna connection to the topsurface of a substrate at a third location of the top surface, whereinthe second location of the first retention mechanism on the bottomsurface is directly below the third location of the second antennaconnection.
 17. The method of claim 15 wherein the substrate is aportion of a module configured to provide a primary radio for a wirelessdevice via the first antenna connection and the first antenna.
 18. Themethod of claim 15 further comprising: attaching a second antennaconnection to the top surface of a substrate at a third location of thetop surface; determining a fourth location on the bottom surface of thesubstrate for a second retention mechanism based on the third locationof the second antenna connection, wherein the fourth location isdirectly below the second antenna connection; and attaching the secondretention mechanism to the bottom surface of the substrate at the fourthlocation on the bottom surface, wherein the second retention mechanismis configured to provide support for the substrate when the secondantenna connection is connected to a second antenna.
 19. The method ofclaim 15 wherein a stress exerted when the first antenna is connected tothe first antenna contention is greater than a normal flex stress on thesubstrate.
 20. The method of claim 15 wherein the first retentionmechanism is a star burst shape.